Micron breaks ground on Singapore fab as it plans about $24 billion chip expansion

Micron Technology said it has broken ground on an advanced wafer fabrication facility in Singapore, launching what it described as a roughly $24 billion investment plan over the next 10 years. The new fab will sit within Micron’s existing NAND manufacturing complex and is designed to add large-scale cleanroom capacity to support long-term demand for memory and storage products.

The company tied the expansion directly to the surge in AI and data-centric computing. As more AI models move from experimentation to deployment, demand for high-performance memory and storage has become a central constraint across data centers and enterprise computing, placing pressure on the supply chain for NAND flash and related technologies.

Micron said wafer output from the new facility is scheduled to begin in the second half of calendar year 2028. The project is intended to provide substantial cleanroom space at scale and to support technology transitions over time, while giving the company flexibility to manage capacity ramps in line with market conditions.

Micron also pointed to its previously announced high-bandwidth memory (HBM) advanced packaging facility at the same Singapore site, which it said remains on track to contribute meaningfully to HBM supply in calendar year 2027. Co-locating major manufacturing and advanced packaging capabilities is positioned as a way to improve efficiency and strengthen resilience as AI-related demand patterns remain volatile.

Beyond technology, the buildout carries labor and ecosystem implications. Micron said the expansion is expected to create around 1,600 jobs tied to fab engineering and operations, with roles increasingly shaped by automation, robotics and smart manufacturing practices. For Singapore, the project reinforces the country’s role as a key node in the global semiconductor supply chain at a moment when governments and companies are competing to secure capacity.